Structural Thermal Pathway Polyurethane Adhesive
Description
Plexus DT2630LD is a two‑component, low‑modulus polyurethane structural adhesive engineered to serve as both a load‑bearing bond and a thermal pathway. With a high thermal conductivity of 2.0 W/mK, Plexus DT2630LD enables heat dissipation directly through bonded interfaces while maintaining excellent mechanical toughness.
Its non‑sag, thixotropic formulation and flame‑resistant performance make it ideal for high‑heat systems.
Benefits
- High thermal conductivity for structural thermal pathways
- Low modulus for stress absorption and durability
- Thixotropic, non‑sag formulation
- UL94 V‑0 flame resistance
- Low odor and low VOC emissions
- EU RoHS and REACH compliant
Thermomechanical Performance
Plexus DT2630LD enables:
- Heat dissipation through bonded joints
- Structural load sharing in thermally active systems
- Long‑term performance in high‑temperature environments
Thermal conductivity: ~2.0 W/mK
Ideal Applications
- EV battery systems
- Data center power distribution units (PDUs)
- Power electronics and cooling plate assemblies
- Industrial systems with high heat retention
Typical Substrates
- Metals
- PET
- Polyester
Environmental Durability
- Excellent resistance to temperature extremes
- Strong resistance to humidity and weathering
- Maintains performance under thermal cycling
Why Choose Plexus DT2630LD
When assemblies demand adhesives that actively contribute to thermal management, Plexus DT2630LD enables engineers to turn bonded interfaces into efficient thermal pathways, without sacrificing mechanical integrity.