Devcon® High Performance Backing Compound
High-strength epoxy liquid for use in rod, ball, pebble, and autogenous mills.
Devcon® HP 250
High-performance, long open time, toughened structural adhesive with outstanding impact, and chemical resistance.
Devcon® Liquid Release Agent
Silicone-type liquid release agent prevents Devcon® epoxy and urethane compounds from sticking to patterns or molds.
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