Devcon® HP 250

Description

A high-performance, room-temperature-curing epoxy adhesive with superior toughness, impact and chemical resistance for structural bonding applications. 2:1 ratio allows you to use the GP Manual gun for easy use!

Key Features

  • Gap-filling thixotropic paste
  • Heat resistant to 250°F
  • Long working time [60-65 minutes]
  • Must use [#14410] manual gun for 400ml size (#14415)
  • Bonds to plastics
  • Open Time: 65 minutes
  • Fixture Time: 300 minutes
  • Gap Fill: 0.01″ – 0.05″
  • Color: Straw
  • Mix Ratio: 2:1
  • Working Time Min: 63
  • Working Time Max: 67
  • Fixture Time Min: 295
  • Fixture Time Max: 305

Only available in North & South America