Devcon® 5 Minute® Epoxy Gel


Fast-curing, thixotropic, non-migrating adhesive designed for filling gaps and bonding rough or smooth surfaces. Disappearing blue coloring tells you when the product is thoroughly mixed for easy use!

Key Features

  • High tensile strength (2,500 psi)
  • Good solvent resistance to gas, oil and other solvents
  • Non sag which makes it ideal for use on vertical surfaces
  • Excellent gap filling qualities without tremendous shrinkage
  • Fast curing for bond tags on machinery and equipment
  • Open Time: 4-7 minutes
  • Fixture Time: 10-15 minutes
  • Gap Fill: 0.01″ – 0.05″
  • Working Time Min: 4
  • Working Time Max: 7
  • Fixture Time Min: 10
  • Fixture Time Max: 15

See our other Devcon® products

Only available in North & South America