Epoxy potting and casting compound designed for production use.
Low viscosity, general purpose potting and casting compound.
Moderate viscosity, self-extinguishing, epoxy potting/casting compound.
Fast setting, low viscosity, flame-retardant (V-0) epoxy system designed for casting applications.
Low viscosity filled epoxy casting compound.
Non-cracking epoxy compound that was specifically designed for large potting and encapsulation applications.
Clear, flowable epoxy resin adhesive designed for high peel strength, flexibility and the ability to bond to varied substrates.
Low viscosity unique silicone-epoxy co-polymer.
Ambient temperature curing, two-component epoxy system with excellent chemical resistance to a broad range of environments.
Epoxy potting and casting compound designed for production use.
Easy to use epoxy casting/potting compound exhibiting excellent adhesion to metals, ceramics and most plastics.
Insulcast 140 FR With ICURE 11B
Epoxy casting system with high thermal conductivity.
Moderate viscosity, self-extinguishing, epoxy potting/casting compound.
Unfilled epoxy with low viscosity for general purpose casting and impregnation.
Unfilled 100% solids epoxy resin casting or impregnating material.
Low density flame retardant epoxy casting system.
Semi-flexible, potting compound that exhibits excellent electrical and physical properties over a wide range of temperatures.
low viscosity, highly filled epoxy formulation.
Insulcure 9 - High hdt, room temperature cure
Insulcure 11B - Temperature resistant, rigid, heat cure
Insulcure 20 - Good impact, rapid cure.
Insulcure 24 - Good flexibility, large castings.
Insulcure 26 - Low viscosity, good impact, very large castings.
Insulcure 27 - Epoxy curing agent.
Insulcure 383 Blue - Epoxy curing agent.
Room temperature curing epoxy gel.
Epoxy compound which exhibits superior thermal shock resistance.
Epoxy compound exhibiting low shrinkage and thermal shock resistance.
Low viscosity and does not normally require vacuum de-gassing to void-free castings and imbedments.
Insulgel 70CC FR NS With ICURE 11B
Epoxy compound which exhibits superior thermal shock resistance.
Soft non-toxic, grease-like compound based on a thickened silicone fluid.
Ideal for detailed reproduction.
High tear strength, high elongation addition cure mold making RTV silicone rubber.
Low viscosity, thermally conductive RTV silicone compound.
Very highly thermally conductive, high temperature RTV silicone compound.
Low viscosity, multi-purpose compound, designed for use as a potting, encapsulating, sealing and mold making material.
Low viscosity UL 94V-0 Flame Retardant, general purpose, reversion resistant RTV Silicone.
Low viscosity UL 94V-0 Flame Retardant, general purpose, reversion resistant RTV Silicone.
Low viscosity, flame retardant, reversion resistant silicone compound.
Low viscosity, general purpose, reversion resistant RTV Silicone Compound and finds use in commercial potting/casting applications.
Low viscosity unique silicone-epoxy co-polymer formulated to withstand severe thermal shock, low moisture absorption and excellent dielectric insulation.
Flame retardant, reversion resistant silicone compound.
Low viscosity Flame Retardant, general purpose, reversion resistant RTV Silicone.
Two component solvent based silicone resin adhesive with excellent lap shear and peel strengths.
Dilute solution of reactive silicone resins.
Dilute solution of reactive silicone resins which can be used to improve or add adhesion of two component addition cure RTV silicones and mold-making compounds.
Dilute solution of reactive silicone resins.
